Analytical Methods

Thin layer laboratories
Dr. K. Ellmer

• Sputtering plants (reactive magnetron sputtering)
• High vacuum coating plant
• Seebeck measuring station
• Optical plasma emission monitor
• Energy-resolved mass spectrometer
• Residual gas mass spectrometer
• 4-point probe measurement set-up
• Chemical vapor phase deposition system
• Hall-effect equipment for conductivity measurements

Material preparation Laboratories
Dr. S. Fiechter

• Catalyst- and layer-synthesis under gas-flow in split-hinge furnaces equipped with quartz tube liners
• Temperature controlled furnaces (up to 1300°C)
• Multi-zone furnaces (up to 1300°C)
• Pumping station to prepare closed silica tubes filled with different gas atmospheres
• X-Ray powder Diffractometer (XRD)
• Differential-thermal gravimetric analysis systems (Differential Scanning Calorimeter (DSC); Thermal Gravimetry coupled with Mass Spectrometry (TG-MS); Differential Thermal Analyzer (DTA))
• Microwave reactor
• Autoclave (500°C, 100 bar)

Interface engineering
Prof. Dr. H. J. Lewerenz

• ESCA system
• Scanning and Tunneling Microscopy (AFM, STM)
• Combined electrochemistry / UHV surface analysis system for synchrotron Radiation-XPS
• Electrochemical characterization (RDE, Impedance)
• Electrochemical Scanning Microscope (ECSM)
• Brewster’s-angle spectroscopy