A sputter deposition tool will be connected through a sample transfer chamber/load lock to the UHV backbone in the SISSY lab enabling in system deposition and characterization using the synchrotron. This will be a multi-source deposition tool with 8 magnetron sputter sources. Multiple dc and rf power supplies and multiple gas lines will allow co-sputtering and reactive sputtering for the deposition of metals, semiconductors and insulators. Sample heating will be possible for small 11x11 mm samples up to 1000 C. The maximum sample size will be 6” wafers.
This flexible deposition tool will be used for combinatorial materials research in functional thin film technology for energy materials. Applications will include thermoelectric materials, catalytic materials, materials for solar energy conversion, and many more.