Marx, V.M.; Kirchlechner, C.; Zizak, I.; Cordill, M.J.; Dehm, G.: Adhesion measurement of a buried Cr interlayer on polyimide. Philosophical Magazine 95 (2015), p. 1982-1991
10.1080/14786435.2014.920543
Open Access Version (externer Anbieter)
Abstract:
A fundamental knowledge and understanding of the adhesion behaviour of metal-polymer systems is important as interface failure leads to a complete breakdown of flexible devices. A combination of in situ atomic force microscopy for studying topological changes and in situ synchrotron based stress measurements both during film tensile testing were used to estimate the adhesion energy of a thin bilayer film. The film systems consisted of 50-200nm Cu with a 10nm Cr adhesion layer on 50m thick polyimide. If the Cu film thickness is decreased to 50nm the Cr interlayer starts dominating the system behaviour. An apparent transition from plastic to predominantly brittle deformation behaviour of the Cu can be observed. Then, compressive stresses in the transverse direction are high enough to cause delamination and buckling of the Cr interlayer from the substrate. This opens a new route to induce buckling of a brittle interlayer between a ductile film and a compliant substrate which is used to determine the interfacial adhesion energy.