Laminar flow wet bench Arias @ Cleanroom EMIL

Laminar flow wet bench

The EMIL cleanroom is equipped for carrying out wet chemical processes (texturing, cleaning), exclusively on silicon wafers of size 4" round up to 156 mm edge length (texturing up to 166 mm edge length). Several laminar flow wet benches are available for this purpose, in which cleaning processes can be carried out using RCA cleaning or ozone cleaning, as well as texturing (etching of random pyramids) in KOH solutions. The appropriate chemicals are available for these processes. 

Selected Applications:
  • Ozone clean
  • Isotropic/anisotropic silicon etching with KOH (and Additiv)
  • HF-dip
  • RCA clean
  • IR-drying

Methods

Working area

The instrument can be used

Laboratories

Cleanroom EMIL

Sample types

Amorphous, Crystal

Short description Laminar flow wet bench for silicon wafers
Usage internal usage
Building/room 14.54 (EMIL) / 0013
Location Adlershof
Additional information In radiation protection area. Operation permitted only after completed laboratory training/instruction.
Instrument parameter
Wafer size Size: 4" round, 5" and 6" square (156 mm edge length to 166 mm edge length). Or custom sizes.
KOH bath temperature max. 90°C
Quantity of wafers 25 samples in one etching process run (common wafer size). Or 1 sample in custom size
Ozone cleaning 1 basin for rough clean and 1 basin for final clean.
RCA bench RCA 1, RCA 2, HF, Rinser

For more details and current status of the Instrument please contact the Instrument Scientist.