Eberstein, M.; Kuhblank, W.; Cicconi, R.; de Ligny, D.; Wimpory, R. C.; Apel, D.; Boin, M.: Impact and Control of Residual Stresses in Ceramic Packages. In: 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) : 15-18 Sept. 2025, World Trade Center, Grenoble, FrancePiscataway, NJ: IEEE, 2025. - ISBN 978-1-7395005-1-1, p. 1-7
10.23919/EMPC63132.2025.11222540
Abstract:
An important challenge in ceramic and hybrid packaging is the joining of different materials within assemblies that demand complex functionality, high performance, and long-term reliability. Often, less attention is given to the fact that manufacturing processes such as co-firing, film deposition, and soldering generate residual stresses between the bonded materials. These stresses can further evolve due to relaxation effects during subsequent processing steps. Understanding the residual stress state is therefore essential, as it directly impacts the quality and performance of the final product throughout its lifecycle. Effective control of these stresses in industrial production requires reliable detection methods that offer both precision and practical applicability. In this context, three measurement techniques for assessing residual stress in ceramic components are presented and compared.