Bernhard, T.; Bamberg, S.; Brüning, F.; Brüning, R.; Gregoriades, L.; Sharma, T.; Brown, D.; Klaus, M.; Genzel, C.: Analysis of stress/strain in electroless copper films. In: International Microelectronics Assembly and Packaging Society [Ed.] : 46th International Symposium on Microelectronics : (IMAPS 2013) ; Orlando, Florida, USA, 30 September - 3 October 2013 Red Hook, NY: Curran, 2013. - ISBN 978-1-62993-824-0, p. 26-30
http://toc.proceedings.com/21113webtoc.pdf
10.4071/isom-2013-TA17
Open Access Version (externer Anbieter)