Lassnig, A.; Putz, B.; Hirn, S.; Többens, D.M.; Mitterer, C.; Cordill, M.J.: Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique. Materials & Design 200 (2021), p. 109451/1-8
10.1016/j.matdes.2021.109451
Open Accesn Version