Ellmer, K.: Magnetron discharges for thin film deposition. In: Hippler, R. [u.a.] [Eds.] : Low Temperature Plasmas : Fundamentals, Technologies and Techniques. Vol. 2Weinheim: Wiley-VCH, 2008. - ISBN 3-527-40673-5, p. 675-714
Abstract:
Magnetron sputtering is a very versatile plasma deposition method invented in the 1930ies by Penning 1,2 but technically introduced only after its re-invention in the 1970ies 3,4. Compared to the old method of diode sputtering 5 magnetron sputtering offers significantly higher deposition rates at lower sputtering pressures, a reduced substrate heating and lower film contaminations. Today, magnetron sputtering is used for the deposition of a large variety of thin films: • Metallic films for reflectors, back contacts etc. 6 • Oxidic and nitridic films for optical and protective coatings 7 • Infrared-reflective films for low emissivity coatings 8,9 • Hard coatings (especially TiN) for tools 10 The principles and applications of magnetron sputtering have been described in a series of review articles 11-16 and text books 17-21, which give a good overview about this technique. In the following chapter the principles of magnetron sputtering are summarized and applications are given with emphasis on thin films for thin film solar cells and especially on active semiconductors in solar cells.